BARCELONA, Spain, Feb. 11 /PRNewswire-FirstCall/ -- 2008 MWC -- Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that it will demonstrate support for the three most popular open operating systems (OpenOSs) on its innovative and cost effective third generation (3G) cellular design platform. With the ability to support Symbian(R), Windows Mobile(R) or Linux(R) on a single monolithic chip, Broadcom demonstrates industry leading OpenOS support at this week's 2008 Mobile World Congress. Powered by the Broadcom(R) BCM2153 dual-core HSDPA processor, this 3G design solution provides a flexible, cost effective platform to drive the increased proliferation of devices based on these operating systems that comprise 90%(1) of the smartphone market.
BARCELONA, Spain, Feb. 11 /PRNewswire-FirstCall/ — 2008 MWC — Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced that it will demonstrate support for the three most popular open operating systems (OpenOSs) on its innovative and cost effective third generation (3G) cellular design platform. With the ability to support Symbian(R), Windows Mobile(R) or Linux(R) on a single monolithic chip, Broadcom demonstrates industry leading OpenOS support at this week's 2008 Mobile World Congress. Powered by the Broadcom(R) BCM2153 dual-core HSDPA processor, this 3G design solution provides a flexible, cost effective platform to drive the increased proliferation of devices based on these operating systems that comprise 90%(1) of the smartphone market.
As the 3G cellular landscape continues to evolve towards higher speed mobile connections, the market is moving to High-Speed Downlink Packet Access (HSDPA), which provides the fastest available throughput for higher speed cellular connectivity and improved network capacity to enable more users. HSDPA handsets typically require additional processing capabilities to support open operating systems such as Symbian, Windows Mobile and Linux, which have the power and flexibility to support the advanced applications enabled by these faster network connections.
Broadcom's advanced BCM2153 smartphone processor features dual ARM(R) CPUs, providing a cost effective solution that eliminates the conventional need for an external discrete application processor and enables a new generation of smartphone products at price points commonly associated with less expensive "feature phone" devices. IDC market research projects that smartphones will represent 22.2 percent of the cell phone market by 2011, compared with 11.1% this year.
"Last year, we introduced the BCM2153 to essentially eliminate the price premiums for smartphone products. Since then, we've aggressively added support for not one, but all three of the most popular open operating systems to further ease the development of smartphones as their market share doubles over the next few years," says Michael Civiello, Senior Director of Marketing for Broadcom's Mobile Communications line of business. "Demonstrating Symbian, Windows Mobile and Linux, all running on the same platform, shows the processing power and flexibility that makes the BCM2153 a strong foundation for next generation smartphone devices."
At the Mobile World Congress, among other demonstrations Broadcom will show the Symbian OS(TM) software platform, Microsoft's Windows Mobile, and a Linux implementation based on LiMo Foundation specifications running on the BCM2153 platform, highlighting the processor's power and flexibility as an engine for innovative smartphone development.
Open OS Industry Support
In an effort to enable third party software developers whose contributions will help to drive smartphone capabilities and future developments, Broadcom has become an active member in the Symbian and Nokia S60 ecosystems and the Linux-based LiMo Foundation. In addition, Broadcom announced expansion of its Taiwan Design Center in May 2007, to increase staff and resources on Windows Mobile applications running on the BCM2153 design platform. The result is that Broadcom has made a substantial commitment to OpenOS development, helping to drive additional opportunities for innovation in the smartphone product category, and is positioned to accommodate any major OpenOS with a complete hardware and software reference design as part of its CellAirity(TM) platform.
The BCM2153 is a member of Broadcom's CellAirity cellular offering — a modular software and hardware platform that provides best-in-class solutions for all of the critical components required for today's advanced mobile devices. CellAirity includes products that enable leading baseband and application processing, 2G and 3G cellular connectivity, multimedia acceleration and power management, as well as peripheral technologies such as Bluetooth(R), Wi-Fi(R), GPS and mobile TV.
(1) In-Stat, November 2007.
Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. We provide the industry's broadest portfolio of state-of-the-art, system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything(R).
Broadcom is one of the world's largest fabless semiconductor companies, with 2007 revenue of $3.78 billion, and holds over 2,500 U.S. and 1,000 foreign patents, more than 7,400 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video and data.
Broadcom is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at +1.949.926.5000 or at http://www.broadcom.com.
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All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward- looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.
Important factors that may cause such a difference for Broadcom in connection with BCM2153 HSDPA processor products include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the broadband communications markets in various geographic regions, including seasonality in sales of consumer products into which our products are incorporated, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for cellular applications; delays in the adoption and acceptance of industry standards in those markets; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; the gain or loss of a key customer, design win or order; our ability to scale our operations in response to changes in demand for our existing products and services or demand for new products requested by our customers; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost-effective and timely manner; intellectual property disputes and customer indemnification claims and other types of litigation risk; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans the quality of our products and any remediation costs; changes in our product or customer mix; the volume of our product sales and pricing concessions on volume sales; the effectiveness of our expense and product cost control and reduction efforts; our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration;; the risks and uncertainties associated with our international operations; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.
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Broadcom(R), the pulse logo, Connecting everything(R), the Connecting everything logo and CellAirity(TM) are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. ARM(R) is a trademark of ARM Limited.
Bluetooth(R) is a trademark of Bluetooth SIG, Inc. Linux(R) is a trademark of Linus Torvalds. Symbian(R) and Symbian OS(TM) are trademarks of Symbian Limited. Wi-Fi(R) is a trademark of Wi-Fi Alliance. Windows Mobile(R) is a trademark of Microsoft Corporation. Any other trademarks or trade names mentioned are the property of their respective owners.
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SOURCE Broadcom Corporation; BRCM Mobile & Wireless