HSINCHU, Taiwan, June 3 /Xinhua-PRNewswire/ -- Ralink Technology, a leading developer of 802.11x chips, today announced two new PCIe interface chipsets that support the next-generation AMD notebook platform. These chipsets are designed to take maximum advantage of the wireless connectivity and overall system performance improvements inherent in the new AMD platform, as well as the new AMD Turion(TM) X2 Ultra Dual-Core Mobile Processor.
HSINCHU, Taiwan, June 3 /Xinhua-PRNewswire/ — Ralink Technology, a leading developer of 802.11x chips, today announced two new PCIe interface chipsets that support the next-generation AMD notebook platform. These chipsets are designed to take maximum advantage of the wireless connectivity and overall system performance improvements inherent in the new AMD platform, as well as the new AMD Turion(TM) X2 Ultra Dual-Core Mobile Processor.
Ralink's latest 802.11n solutions — the RT2800, 802.11 a/b/g/n 2T2R/2T3R (2 Transmit 2 Receive or 2 Transmit 3 Receive) PCIe interface chipset and RT2700, 802.11 a/b/g/n 1T2R PCIe interface chipset — have been designed as part of the Better By Design program, which focuses on delivering the best PC platforms including wireless capabilities for notebook PC systems on the market. The RT2800 and RT2700 boast 300 Mbps PHY rate (physical rate), legacy, mixed, green-field modes, 20 MHz and 40 MHz bandwidth support, reverse direction data flow and frame aggregation, 802.11i security, Wake on Wireless LAN, multiple BSSID, Cisco CCX and low power with advanced power management among other features that support optimal wireless performance while helping extend notebook battery life.
The next-generation AMD notebook platform features AMD Turion (TM) X2 Ultra Dual-Core Mobile Processors, ATI Radeon(TM) HD 3000 series graphics, AMD 7-Series chipset and industry-leading wireless technologies like Ralink Technology's RT2800 and RT2700. These components were optimized to work together for stunning visual performance and energy efficiencies for an enhanced user experience.
"We are glad to team with AMD to provide a robust wireless LAN with extended coverage and superior throughput for their next-generation notebook platform," said Rick Jeng, president of Ralink Technology. "Ralink is delivering state-of-the-art WLAN solutions for notebooks that work in concert with the innovative platform technologies from AMD to dramatically improve wireless performance for users, allowing them to seamlessly create, access and share rich content on the go
"Today's notebook users want the best technology they can buy, with incredible visual performance and far-reaching mobility with long battery life — all in a notebook PC that delivers exceptional value," said Chris Cloran, corporate vice president, Notebook Division, AMD (NYSE: AMD). "AMD and its technology partners created the Better By Design program to meet this market need, and AMD is working closely with Ralink to deliver their latest 802.11n solutions with seamless wireless connectivity for our next-generation notebook platform."
The RT2800 and RT2700 are currently in mass production and support Windows Vista, Windows XP, Windows 2000, Windows ME, Windows 98SE, Linux and Mac OS X. The reference design is available upon request.
About Ralink Technology
Ralink Technology Corporation is a leading innovator and developer of wireless LAN chipset solutions. Ralink 802.11x chipsets are recognized for superior throughput, extended range, low-power consumption and consistent reliability demanded by Wi-Fi, mobile and embedded applications. These feature-rich chipsets have a high level of chip integration for client and AP solutions for CB, miniPCI, PCI, PCIe and USB interfaces, enabling customers to build smaller and more sophisticated mobile wireless products cost-effectively. Ralink's patented MIMObility(TM) technology extends Wi-Fi applications from traditional PC networking to a range of digital multimedia and handheld devices including cell phones, PDAs, cameras, print servers, HDTV and video game players. Ralink customers can look forward to continuous improvements in speed, bandwidth and reliability with 802.11n solutions for next-generation high-performance Wi-Fi. Ralink Technology was founded in 2001 with headquarters in Jhubei, Taiwan and an R&D center in Cupertino, California. For more information, visit Ralink at http://www.ralinktech.com or send email to firstname.lastname@example.org.
AMD, the AMD Arrow logo, AMD Turion, and combinations thereof, and ATI Radeon are trademarks of Advanced Micro Devices, Inc.
Media Contact: Ralink Vivien Huang Tel: +886-3560-0868 ext 1605 Email: Vivien_Huang@ralinktech.com.tw
SOURCE Ralink Technology