Cool Crunching: Understanding Green HPC

With power and cooling costs becoming a serious concern, enterprises need strategies and technologies to take HPC green.

The green approach has come to HPC. While green designs are often associated with low power and low performance, in HPC, however, green is about efficiency, high performance, and maximizing your computing dollar.

Power and cooling have become the number one issue facing many HPC sites and a green design is one answer to this problem. Join our panel of experts from IBM and Intel as they discuss the strategies and technologies for getting more out of your computing budget with green approach. Topics to be discussed include:

  • Defining Green HPC: Opportunities and Benefits
  • Intel power saving designs;
  • IBM’s innovative packing solutions;
  • Your questions





Speaker Bios

Ishan Sehgal
Program Director — Worldwide System x HPC Marketing

Ishan Sehgal manages System x High Performance Computing and Integrated Clustered Solutons marketing within IBM Systems and Technology Group. The Clustered Solutions portfolio spans System x rack servers, blades, and iDataPlex comprising over $1 billion in annual revenue. During his previous 5 years at IBM Ishan was responsible for worldwide product marketing for IBM BladeCenter data and storage networking. He led the creation of a networking portfolio central to IBM’s leadership in blades. Prior to joining IBM, Ishan held various leadership positions at Nortel in Sales, Marketing, and Business Development over 18 years. Ishan holds a Bachelor of Science degree in electrical engineering from North Carolina State University and a Masters of Business Administration from the Fuquay School of Business at Duke University.
Michael K Patterson
Senior Thermal Architect

Michael K Patterson works in the Eco Technology Program Office in the Digital Enterprise Group at Intel Corporation, Hillsboro, OR, where he works in the power, thermal, and energy-efficient performance areas. The work covers silicon level activity, through platform and rack level solutions, and on up to interface with Data Center power and cooling technologies. He did his undergraduate work at Purdue University, received his MS degree in Management from Rensselaer Polytechnic Institute, and was awarded his MS and PhD in Mechanical Engineering from the University of Vermont. His current technical interests include server power and thermal management technologies, server/datacenter interaction, and high density data center concepts. He has been with Intel for 14 years. He is a registered Professional Engineer. He is also a member of ASHRAE and ASME and represents Intel in a number of Green Grid Activities.

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